JPS644339B2 - - Google Patents

Info

Publication number
JPS644339B2
JPS644339B2 JP708579A JP708579A JPS644339B2 JP S644339 B2 JPS644339 B2 JP S644339B2 JP 708579 A JP708579 A JP 708579A JP 708579 A JP708579 A JP 708579A JP S644339 B2 JPS644339 B2 JP S644339B2
Authority
JP
Japan
Prior art keywords
adhesive tape
semiconductor wafer
present
article
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP708579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5599741A (en
Inventor
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP708579A priority Critical patent/JPS5599741A/ja
Publication of JPS5599741A publication Critical patent/JPS5599741A/ja
Publication of JPS644339B2 publication Critical patent/JPS644339B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Connection Of Plates (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Dicing (AREA)
JP708579A 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape Granted JPS5599741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP708579A JPS5599741A (en) 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP708579A JPS5599741A (en) 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape

Publications (2)

Publication Number Publication Date
JPS5599741A JPS5599741A (en) 1980-07-30
JPS644339B2 true JPS644339B2 (en]) 1989-01-25

Family

ID=11656244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP708579A Granted JPS5599741A (en) 1979-01-26 1979-01-26 Affixing method of article onto adhesive tape

Country Status (1)

Country Link
JP (1) JPS5599741A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115833A (ja) * 1981-12-28 1983-07-09 Sony Corp ウエ−ハの分割方法
JPS59152639A (ja) * 1983-02-21 1984-08-31 Nec Home Electronics Ltd 半導体ウエ−ハ仮固着方法
JPS61222146A (ja) * 1985-02-12 1986-10-02 Matsushita Electronics Corp 半導体ウエハ支持装置
CN110767612B (zh) * 2018-07-27 2021-06-18 奇景光电股份有限公司 贴合结构与贴合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531614B2 (en]) * 1972-10-04 1980-08-19
JPS5318969A (en) * 1976-08-06 1978-02-21 Nippon Telegr & Teleph Corp <Ntt> Wafer fixing method
JPS5390871A (en) * 1977-01-21 1978-08-10 Toyo Dengu Seisakushiyo Kk Device for chucking semiconductor wafer

Also Published As

Publication number Publication date
JPS5599741A (en) 1980-07-30

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